| SPECIFICATION | 
  | 
| Model | 
BXNUC10I3FNHJA | 
| Processor | 
- A soldered-down 10th generation Intel Core i3-10110U Processor with a maximum 25W TDP, 2.1GHz base , 4.1GHz Turbo, 4Threads
 
- Intel UHD Graphic
 
- 4MB Intel Smart Cache
 
- Integrated memory controller
 
- Intergrated PCH
 
 
 | 
| Memory  | 
- Two 260-pin DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM) sockets
 
- Support for DDR4 2666 MHz SO-DIMMs
 
- Support for 8Gb and 16 Gb memory technology
 
- Support for up to 64 GB of system memory with two SO-DIMMs using 16GB memory technology
 
- Support for non-ECC memory
 
- Support for 1.2 V low voltage JEDEC memory only
 
 
Note: 2Gb and 4Gb memory technology (SDRAM Density) is not compatible | 
| Graphics | 
- Integrated graphics support for processors with Intel® Graphics Technology
 
- One High Definition Multimedia Interface* (HDMI*) v2.0b Back panel connectors
 
- One DisplayPort signal via USB Type C back panel connector
 
 
 | 
| Audio | 
- Intel High Definition (Intel HD) Audio via the HDMI and USB Type C interfaces through the processor
 
- Realtek HD Audio via a stereo microphone/headphone 3.5mm jack on the front panel
 
- Digital microphone array (DMICS) connector (Internal)
 
 
 | 
| Storage | 
- SATA Port: One SATA 6.0Gbps port (black) for 2.5" storage device
 
- One SATA 6.0Gbps port is reserved for an M.2 stroage module supporting M.2 2242 and M.2 2280 (Key typeM) modules
 
 
Note: Supports key type M (PCI Express* x4 and SATA) | 
| Peripheral Interfaces | 
- USB 3.1 (Gen2/10 Gbps) Type C ports:
 
- One port is implemented via the external front panel Type C connector
 
- One port is implemented via the external back panel Type C connector
 
- USB 3.1 (Gen2/10 Gbps) Type A ports: 
 
- One port is implemented via external front panel connectors (blue)
 
- Two ports are implemented via external back panel connectors (blue)
 
- USB 2.0 ports:
 
- Two ports via two single-port internal 1x4 1.25mm pitch headers (white)
 
- One port is reserved foe the NGFF 1216 Wireless module Bluetooth capability
 
- Consumer Infrared (CIR)
 
 
 | 
| Expansion Capabilities | 
- One M.2 connectors supporting M.2 2242 and M.2 2280 (key type M) modules
 
- One Micro SDXC slot
 
- One Thunderbolt 3 via back panel USB Type C connector
 
 
 | 
| BIOS | 
- Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device 
 
- Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and System Management BIOS (SMBIOS), and Modern Standby
 
 
 | 
| Instantly Available PC Technology | 
- Suspend to RAM support 
 
- Wake on PCI Express, LAN, front panel, CIR, and USB ports
 
 
 | 
| LAN  | 
- Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I219V Gigabit Ethernet Controller
 
 
 | 
| Hardware Monitor Subsystem | 
Hardware monitoring subsystem, based on an embedded controller including:  
- Voltage sense to detect out of range power supply voltages 
 
- Thermal sense to detect out of range thermal values 
 
- One processor fan header 
 
- Fan sense input used to monitor fan activity 
 
- Fan speed control
 
 
 | 
| Wireless | 
- Intel Wi-Fi 6 AX201,802.11ac, Dual Band, 2x2 Wi-Fi + Bluetooth 5
 
- Maximum Transfer speed up to 2.4 Gbps
 
- Next Generation Form Factor (NGFF) 12x16 soldered-down package
 
- Support OFDMA, 1024QAM, Target Wake Time (TWT) and spatial reuse
 
 
 | 
| From Factor | 
UCFF (4" x 4")
  | 
| Warranty  | 
3 Years |